- Company Name : Henchman Technology Limited
- About Us : <br> <br>Henchman Technology Limited IC packaging house especially in BGA, LGA, QFN, CSP, MCM, stacked dies, and other packaging with lead frames. We have a full range of facilities in our company and be able to do flip chip, COF and others. Fast delivery. <br /> <br />We can give you a proposal for how to pack an IC. We can make samples for you for evaluation. We provide one-stop service for your requirement. Please contact us when you have a project on hand. Project preview is free of charge. <br /><br><br>
- Product/Service : BGA, LGA, QFN, CSP, MCM
- Category : Business Services
- Contact Person : James Chong
- Link More : Hong Kong Business Services ,
- Telephone :
- Fax :
- Address : Rm23,17/F.,Well Fung Ind. Center,68 Ta Chuen Ping Street, Kwai Chung Hong Kong
- Website : http://www.henchtech.com
- Business Type : Manufacturer
