NIHON MICRON CO.,LTD.Realization of ideas
Introduction:
Founded in 1975, we are one the leading manufacturer special design
printed circuit board Japan. Our company is located Nagano. It takes
about 2.5 hours by train from central Tokyo.
Our product:
For mobile phone, digital household appliances, LED, ....Address:3-4-5, KawagishikamiProduct/Service:printed-circuit board,printed board,PCB&PCBA,Rigid,Double,Product,PCB,substrate,rigid PCB,Technology,PCB,substrate,rigid PCB,,,,printed-circuit board,printed board,PCB&PCBA,Rigid,Double,Product,PCB,substrate,rigid PCB,Technology,PCB,substrate,rigid PCB,,,Shinko Electric Industries Co., Ltd.Our company produces semiconductor package such as lead frames' and plastic laminate's packages. We are looking for suppliers of parts material well partners contract manufacturing. 1. Parts Material: Timber wooden box, medicine, electricity, machine part, consumption articles, others 2. ....Address:1216-9, KusamaProduct/Service:Semiconductor package, lead frames'/plastic laminate's packages. , Metal Wall Package,Fiber Metalization,Module assembly,Packaging System,Open Tool,Packaging System,Standard Package [FBGA/FLGA],Packaging System,Open Tool,Rivet,VQFN (Plastic Very Thin Quad Flat Non-leaded),Open Tool,Open Tool,Flexible Substrate [Tape BGA],RF Ceramic Package,Heat Spreader,Metal Dome,Electro Static Chuck,Camera module assembly,Micro Collimator(Lensed Fiber),Surge Protective Device,Glass-to-Metal Seals,Switching Spark Gap for HID Lamp,Plastic-BGA substrate,Open Tool,Multilayer Lead Frame,Build-up Substrate,SFP-LF (Super Fine Pitch Stamped Lead Frame),Open Tool,Open Tool,Pd-P.P.F. (Palladium Pre Plated Lead Frame),,Semiconductor package, lead frames'/plastic laminate's packages. , Metal Wall Package,Fiber Metalization,Module assembly,Packaging System,Open Tool,Packaging System,Standard Package [FBGA/FLGA],Packaging System,Open Tool,Rivet,VQFN (Plastic Very Thin Quad Flat Non-leaded),Open Tool,Open Tool,Flexible Substrate [Tape BGA],RF Ceramic Package,Heat Spreader,Metal Dome,Electro Static Chuck,Camera module assembly,Micro Collimator(Lensed Fiber),Surge Protective Device,Glass-to-Metal Seals,Switching Spark Gap for HID Lamp,Plastic-BGA substrate,Open Tool,Multilayer Lead Frame,Build-up Substrate,SFP-LF (Super Fine Pitch Stamped Lead Frame),Open Tool,Open Tool,Pd-P.P.F. (Palladium Pre Plated Lead Frame),EAGER CORPORATION LTD.We, Eager corp. Supply silicon wafers, silicon ingots, sapphires, quartz glass, special glass, various ceramics and the precision processing of them.Also, the more than 50 excellent domestic partners make all the precision processing possible..Address:3-1-1 Maze Tadaoka-choProduct/Service:Silicon wafers,Silicon ingots,Silicon scraps,Quartz tubes,Quartz plates,Quratz wares , Sapphire Wafer (Substrate) Both Side Polished,Sapphire Wafer (Substrate) Half Side Polished,Two Electrodes Flat Cell,2 inches GaN wafer (substrate),2 inches GaN wafer (substrate),Planetary Mixer,Auto Film Coater,Automatic Coin Cell Crimper w/Die unit,Compact Electrode Slitting Machine,Compact Roller Press Machine,Knife Over Roll Coater,Precision Ultrasonic Welding Machine,Cylindrical Cell Crimping Machine,Cylindrical Cell Grooving Machine,Cylindrical Cell Winding Machine,Electrolyte Filling Machine,Electrolyte Filling Machine,Three Electrodes Flat Cell,Electodes Slide Glass Cell,Transparent Glass Cell,,Silicon wafers,Silicon ingots,Silicon scraps,Quartz tubes,Quartz plates,Quratz wares , Sapphire Wafer (Substrate) Both Side Polished,Sapphire Wafer (Substrate) Half Side Polished,Two Electrodes Flat Cell,2 inches GaN wafer (substrate),2 inches GaN wafer (substrate),Planetary Mixer,Auto Film Coater,Automatic Coin Cell Crimper w/Die unit,Compact Electrode Slitting Machine,Compact Roller Press Machine,Knife Over Roll Coater,Precision Ultrasonic Welding Machine,Cylindrical Cell Crimping Machine,Cylindrical Cell Grooving Machine,Cylindrical Cell Winding Machine,Electrolyte Filling Machine,Electrolyte Filling Machine,Three Electrodes Flat Cell,Electodes Slide Glass Cell,Transparent Glass Cell,PHONON MEIWA INC.This supplier has not provided a Company Introduction yet..Address:965, Anada-choProduct/Service:Ceramic Rods,Ferrite Core,Ceramic Core,Alumina substarate,Ceramic Coiled Springs , Ceramic substrate (Alumina substarate),Metal Glazed Resistor Elements,Ceramic Pin, Pipe,Column Type,Thin Pipe,Utility Setter for Sintering,Sintering Setter,High Density Multi-Printing Ceramic Substrate,Low Profile Ferrite Drum Core for Power Inductor,Film Resistor Element,Resistor Ceramics,Power Inductor Base,Microwave dielectric substrates,Ferrite Core for Chip Common Mode Choke Coil,Flat Plate,Thin Column,Ceramic Core for Chip Inductor,Ceramics for Polishing,Ceramic Coiled Springs,Cramic Packages and HTCC substrates for LED.,Ceramic Tube, Isolation Tube, Protection Tube, Pipe for Fuse,Ferrite Chip Core for Chip Inductor,,Ceramic Rods,Ferrite Core,Ceramic Core,Alumina substarate,Ceramic Coiled Springs , Ceramic substrate (Alumina substarate),Metal Glazed Resistor Elements,Ceramic Pin, Pipe,Column Type,Thin Pipe,Utility Setter for Sintering,Sintering Setter,High Density Multi-Printing Ceramic Substrate,Low Profile Ferrite Drum Core for Power Inductor,Film Resistor Element,Resistor Ceramics,Power Inductor Base,Microwave dielectric substrates,Ferrite Core for Chip Common Mode Choke Coil,Flat Plate,Thin Column,Ceramic Core for Chip Inductor,Ceramics for Polishing,Ceramic Coiled Springs,Cramic Packages and HTCC substrates for LED.,Ceramic Tube, Isolation Tube, Protection Tube, Pipe for Fuse,Ferrite Chip Core for Chip Inductor,SANYU GIKEN Co.,LtdThank You For Coming Our ALIBABA Site!!SANYU GIKEN Co.,Ltd for Automatic Laborsaving Machine.You Have Trouble,worry about Machine?Technology uniting "Mechatronic" with "Technique Mind".We Dream the birth of new life,and make persistent effort. ....Address:1183-1, NaritaProduct/Service:Automatic Machine , Precision instrument field (Machine and Device) Substrate supply & storage Device,Precision instrument field (Machine and Device) Unitcase bending &assembly Machine,Precision instrument field (Machine and Device) Electric characteristic inspection &laser marking Machine,Precision instrument field (Machine and Device) Label attachment Machine,Automotive field (Machine and Device) Welding,cutting &inspection Machine,Automotive field (Machine and Device) Fuse welding &cutting Machine,Automotive field (Machine and Device) Connector assembly Machine,Automotive field (Machine and Device) Connector assembly Machine,Semiconductor field (Machine and Device) Element inspection,sorting &taping Device,Semiconductor field (Machine and Device) Lead frame inspection Device,Semiconductor field (Machine and Device) High-speed IC Handler,Semiconductor field (Machine and Device) Characteristic inspection Device for Wafer,,Automatic Machine , Precision instrument field (Machine and Device) Substrate supply & storage Device,Precision instrument field (Machine and Device) Unitcase bending &assembly Machine,Precision instrument field (Machine and Device) Electric characteristic inspection &laser marking Machine,Precision instrument field (Machine and Device) Label attachment Machine,Automotive field (Machine and Device) Welding,cutting &inspection Machine,Automotive field (Machine and Device) Fuse welding &cutting Machine,Automotive field (Machine and Device) Connector assembly Machine,Automotive field (Machine and Device) Connector assembly Machine,Semiconductor field (Machine and Device) Element inspection,sorting &taping Device,Semiconductor field (Machine and Device) Lead frame inspection Device,Semiconductor field (Machine and Device) High-speed IC Handler,Semiconductor field (Machine and Device) Characteristic inspection Device for Wafer,
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