XG TECHNOLOGIES CO., LTD

Company Name : XG TECHNOLOGIES CO., LTD
About Us : 1. Semiconductor Field 2. IT Field (Telecommunication System Board) 3. Auto Mobile Board Field/High Current Distribution 4. High Current PoXG TECHNOLOGIES CO., LTDr Supply Board 5. LED PKG 6. Medical Equipment Board Our PCB technology includes 1. HPL technique (Hole Plugging Land): Via on PAD technique, forming via hole under SMD pad 2. TGFR: Track Gap Filled Resin 3. Multi-copper thickness PCB 4. Metal Core PCB Structure 5. Special Metal Core PCB: This new technique can radiate heat effectively from product and apply for LED package reflector 6. Special LED PKG PCB: New technique for radiating heat 7. Ceramic PCB Metalizing Technique: 8. Embedded resistor PCB 9. Radiation Solder Mask 10. High Reflection Resin PCB 11. High Young's Modulus Resin: Prevents PCB board crack by it's high elasticity at the lead free soldering. 12. Multi Cavity PCB: Minimizes the PCB thickness & chip mounted PCB can be multi stack-up. 13. Multi Resin Board PCB
Product/Service : circuit board,pcbs, Circuit board,pcb
Country/Region : China >
Category : Electrical Equipment & Supplies
Contact Person : Mr. REY FICO (Business Development Manager)
Link More : China Electrical Equipment & Supplies ,China Passive Components
Telephone :
Fax :
Mobile phone :
Address : BaoMin, Shenzhen, Guangdong, China
Website : http://www.xg-technologies.com
Business Type : Manufacturing